Thermocouples are inserted into dough to give a thermal profile.
Thermal profiling is useful when a new product is launched. If your new product is experiencing dryness issues, you could be overbaking it. This can easily be remedied by adjusting time and/or temperature. But how much time and temperature do you have to reduce? This is where thermal profiling can help you adjust the baking temperature and baking time for the commercialization of a new baked product.
As with most high-speed lines, the oven could be the bottle-neck of the entire process. Which means, that its flexibility for a throughput is very limited, and you only have a small window of a few minutes to play with. With this in mind, send your first thermal profile reading through the oven. We will call this Bread A.
Ovens operate with different burners and dampers for different zones. Therefore, understanding what Bread A experiences throughout the baking process will help us manipulate the thermal profile for Bread B.
For this experiment, we used 175 g per loaf for bread A and 200 g per loaf for bread B. We used ECD thermal profiler with M.O.L.E. MAP3 to record the temperature profile during baking. Table 1 shows the vital information from thermal profiles.
Table 1 Baking parameters and thermal profiling information for Bread A and B: